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Narrow candidates fast by category, thermal conductivity, and thermal resistance, then add them to a side-by-side comparison table. Values are drawn from product decks — refer to the official TDS before mass production.
27 matches
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Standard PadThermal Pads · General-purpose cooling
1–15
W/m·K
Rth
Thickness
Ultra-Soft PadThermal Pads · Extremely low compression stress
3–8
W/m·K
Rth
Thickness
High-Resilience PadThermal Pads · Vibration and thermal cycling resistant
6–20
W/m·K
Rth
Thickness
Low Oil-Bleed PadThermal Pads · Low exudation
9–15
W/m·K
Rth
Thickness
Insulating PadThermal Pads · Electrical insulation
2–15
W/m·K
Rth
Thickness
High-Strength Wear-Resistant PadThermal Pads · Scratch and abrasion resistant
12–18
W/m·K
Rth
Thickness
Low-Volatility PadThermal Pads · Ultra-low siloxane outgassing
3–8
W/m·K
Rth
Thickness
Non-Silicone PadThermal Pads · Silicone-free, no silicone migration
2.5–3.5
W/m·K
Rth
Thickness
Aerospace-Grade Thermal GreaseThermal Grease / Liquid Metal · High stability, low volatility
1–3
W/m·K
Rth
Thickness
High-Performance Thermal GreaseThermal Grease / Liquid Metal · Mainstream CPU/GPU
3
W/m·K
0.13
Rth
Thickness
High-Conductivity Thermal GreaseThermal Grease / Liquid Metal · High power density
5
W/m·K
0.07
Rth
Thickness
Liquid Metal Compound GMAPThermal Grease / Liquid Metal · Ultimate thermal conductivity for AI/HPC
10
W/m·K
0.03
Rth
Thickness
Standard Thermal GelThermal Gels · Auto-dispensing, large-area
3.5–14
W/m·K
Rth
Thickness
Low-BLT GelThermal Gels · Extremely thin bond line
3–6
W/m·K
Rth
Thickness
Post-Cure Thermal GelThermal Gels · Anti-flow after curing
9–20
W/m·K
Rth
Thickness
Reworkable Thermal GelThermal Gels · Rework/removal without component damage
3
W/m·K
Rth
Thickness
Lightweight Thermal GelThermal Gels · Reduces overall system weight
2–3
W/m·K
Rth
Thickness
Ultra-Thin Carbon Fiber PadCarbon Fiber Pads · 0.1–0.3 mm
25–50
W/m·K
Rth
0.1–0.3 mm
Thickness
Standard Carbon Fiber PadCarbon Fiber Pads · 0.3–2 mm
20–70
W/m·K
Rth
0.3–2 mm
Thickness
Ultra-Soft Carbon Fiber PadCarbon Fiber Pads · 1–3 mm
25
W/m·K
Rth
1–3 mm
Thickness
Insulating PCMPhase Change Materials · Also provides insulation
8.5
W/m·K
0.04
Rth
Thickness
High-Performance PCMPhase Change Materials · Replaces degraded grease
7.5
W/m·K
0.05
Rth
Thickness
Low-Dielectric PCMPhase Change Materials · High-frequency signal friendly
2–5
W/m·K
Rth
Thickness
Injection-Molded AbsorberAbsorbers / Shielding · Sub-6G / 77 · 100GHz
W/m·K
Rth
Thickness
Thermally Conductive Absorber PadAbsorbers / Shielding · Absorbs and dissipates heat
3–5
W/m·K
Rth
Thickness
Thermally Conductive Absorber GelAbsorbers / Shielding · Fills complex structures
6–8
W/m·K
Rth
Thickness
Conductive Rubber / Sealing GasketAbsorbers / Shielding · EMI shielding + sealing
W/m·K
Rth
Thickness

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