When chip wattage or power draw spikes,
let TIM be your edge
TOUPPER provides complete thermal interface solutions from low-melting alloy and thermal gel to phase change materials, paired with precision bonding and PUR technology, solving thermal and reliability challenges for AI/HPC, automotive electronics, and telecom equipment.
From Interface to Structure, All in One Place
We don't just sell materials — starting from your thermal and bonding pain points, we support you from selection and samples through mass production.
Advanced Thermal Interface
Low-melting alloy, thermal gel, pads, and phase change materials — a full lineup covering thermal flux needs from consumer electronics to AI servers.
- Low-Melting Alloy TIM SIBIN Series
- High-Performance Thermal Gel
- Phase Change Material PCGP
Precision Bonding
Reworkable underfill, corner-fill, and thermally conductive underfill adhesives — balancing structural strength, reworkability, and thermal conductivity.
- Reworkable Underfill / Corner-Fill Adhesive
- Thermally Conductive Underfill 1–2 W/m·K
- High-Reliability Formulas for Automotive Modules
PUR & EMI Absorption/Shielding
PUR solutions paired with injection-molded absorbers and conductive shielding materials — solving everything from mechanical potting to EMI in one step.
- Injection-Molded / Thermally Conductive Absorber Pads
- Sub-6GHz to 77/100GHz
- Conductive Rubber / Sealing Gaskets
Cooling Components
Heat pipes in four wick structures: Φ6–Φ12 diameters, ultra-thin flattening from 0.4mm, custom bending and sampling to your power and space envelope.
- Heat pipes, Qmax up to 120W
- Ultra-thin flattening down to 0.3mm
- Sampling from 7 days
Choose the Right Material by the Numbers
Filter 25+ models by thermal conductivity, thermal resistance, and thickness, then compare them side by side to find the best fit. Values are typical — refer to the official TDS before mass production.
From Servers to Steering Wheels
Thermal and reliability challenges vary by industry — we map recommended materials to your application.
AI / HPC Servers
High heat flux density from GPUs and switch chips makes low-melting alloy and high-performance thermal gel the top choice.
Automotive Electronics
IGBT, BMS, and ADAS modules require high-reliability formulas resistant to vibration and thermal cycling.
Telecom / 5G
Base stations and RF modules — integrated absorption and thermal solutions from Sub-6 to 77/100GHz.
Consumer Electronics
Laptops, phones, and wearables — lightweight, ultra-thin, low-stress solutions.
Not sure which one to use?
Tell us your power, gap, and operating temperature — TOUPPER's technical team will help you select and provide samples.