When chip wattage or power draw spikes,
let TIM be your edge
TOUPPER provides complete thermal interface solutions from liquid metal and thermal gel to phase change materials, paired with precision bonding and PUR technology, solving thermal and reliability challenges for AI/HPC, automotive electronics, and telecom equipment.
From Interface to Structure, All in One Place
We don't just sell materials — starting from your thermal and bonding pain points, we support you from selection and samples through mass production.
Advanced Thermal Interface
Liquid metal, thermal gel, pads, and phase change materials — a full lineup covering thermal flux needs from consumer electronics to AI servers.
- Liquid Metal Alloy GMAP
- High-Performance Thermal Gel PCGP
- Phase Change Material PCM
Precision Bonding
Reworkable underfill, corner-fill, and thermally conductive underfill adhesives — balancing structural strength, reworkability, and thermal conductivity.
- Reworkable Underfill / Corner-Fill Adhesive
- Thermally Conductive Underfill 1–2 W/m·K
- High-Reliability Formulas for Automotive Modules
PUR & EMI Absorption/Shielding
PUR solutions paired with injection-molded absorbers and conductive shielding materials — solving everything from mechanical potting to EMI in one step.
- Injection-Molded / Thermally Conductive Absorber Pads
- Sub-6GHz to 77/100GHz
- Conductive Rubber / Sealing Gaskets
Choose the Right Material by the Numbers
Filter 25+ models by thermal conductivity, thermal resistance, and thickness, then compare them side by side to find the best fit. Values are drawn from product datasheets — refer to the official TDS before mass production.
From Servers to Steering Wheels
Thermal and reliability challenges vary by industry — we map recommended materials to your application.
AI / HPC Servers
High heat flux density from GPUs and switch chips makes liquid metal and high-performance thermal gel the top choice.
Automotive Electronics
IGBT, BMS, and ADAS modules require high-reliability formulas resistant to vibration and thermal cycling.
Telecom / 5G
Base stations and RF modules — integrated absorption and thermal solutions from Sub-6 to 77/100GHz.
Consumer Electronics
Laptops, phones, and wearables — lightweight, ultra-thin, low-stress solutions.
Not sure which one to use?
Tell us your power, gap, and operating temperature — TOUPPER's technical team will help you select and provide samples.