Let the Interface Become the Thermal Solution
From Interface to Structure, All in One Place
In the high-power era of AI/HPC, automotive electronics, and communications equipment, thermal management and reliability are decisive to a product's success. TOUPPER offers a complete thermal interface lineup — from liquid metal, thermal gel, and thermal pads to phase change materials — paired with precision bonding and PUR technology, helping customers balance heat flux density, mechanical reliability, and production yield.
We don't just supply materials — we start from our customers' thermal and bonding pain points, offering full technical support from selection and samples through mass production.
Joint Lab with a Leading University
TOUPPER has established a joint lab with a leading university, investing in R&D and validation of thermal interface materials and bonding technologies, turning academic research into production-ready material solutions.
What We Do
Advanced Thermal Interface
A full lineup of liquid metal, thermal gel, thermal pads, and phase change materials, covering thermal needs from consumer devices to AI servers.
View Specs →Precision Bonding
Reworkable underfill and corner-fill, plus thermally conductive underfill, balancing structural strength, reworkability, and thermal conductivity.
View Specs →PUR · Absorber & Shielding
PUR polyurethane solutions paired with injection-molded absorbers and conductive shielding materials, solving everything from mechanical potting to EMI in one step.
View Specs →Company Profile
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Tell us about your application and spec requirements — we'll help with selection and provide samples.