SIBIN Series Low-Melting Alloy TIM
A gallium-free low-melting alloy thermal interface material with liquid-metal-class performance: it fills every air gap once it reaches its design melting point, then solidifies in place with no pump-out or sag. It does not corrode aluminum, is easy to rework, and its melting point and thermal conductivity can be tailored to your application.
Three Standard Melting Points, Selected by Chip Control Temperature
The model number is the design melting point. Selection rule: choose a melting point slightly below the chip control temperature so the material finishes gap-filling before reaching operating temperature. Values below were measured per ASTM D5470 at 20psi.
| Model | Melting Point | Conductivity | Resistance | Bond Line (BLT) |
|---|---|---|---|---|
| SIBIN#62 Low-temperature activation; consumer and edge computing | 62℃ | 12.0 W/m·K | 0.042 ℃·cm²/W | 39 µm |
| SIBIN#92 Mainstream CPU / GPU operating temperatures | 75–94℃ | 25.1 W/m·K | 0.036 ℃·cm²/W | 50 µm |
| SIBIN#105 AI accelerators and high power density chips | 100–108℃ | 33.2 W/m·K | 0.006 ℃·cm²/W | 68 µm |
Measured Thickness × Resistance
| Thickness (mm) | Resistance (℃·cm²/W) |
|---|---|
| 0.039 | 0.042 |
| 0.087 | 0.087 |
| 0.128 | 0.116 |
| Thickness (mm) | Resistance (℃·cm²/W) |
|---|---|
| 0.050 | 0.036 |
| 0.146 | 0.072 |
| 0.322 | 0.144 |
| Thickness (mm) | Resistance (℃·cm²/W) |
|---|---|
| 0.068 | 0.006 |
| 0.150 | 0.025 |
| 0.382 | 0.099 |
Common Properties
Fills on Heating, Holds on Cooling
SIBIN is designed to fill every air gap between the heat source and the thermal module on its own at a design melting point slightly below the chip control temperature — without relying on high clamping force.
Install at Low Clamping Force
Mount the alloy pad at a standard 20psi socket clamping force; no extra pressure hardware is needed.
Heat to the Design Melting Point
By material design SIBIN does not fully liquefy; it forms a highly viscous paste that fills all air gaps and avoids pump-out.
Cool and Hold Shape
Below the melting point it returns to a solid while keeping its shape, so the gaps stay filled with no sag — and the pad lifts off in one piece for rework.
Product Advantages
- Up to 33.2 W/m·K conductivity and resistance as low as 0.006 ℃·cm²/W — liquid-metal-class performance
- Gallium-free: does not corrode aluminum, works with thermal modules of any material
- Holds its shape after solidifying; never fully liquefies, so no pump-out or sag
- Easy rework: the solid pad is placed and removed in one piece without damaging parts
- Melting point and thermal conductivity tailored to your application
- Low thermal resistance at just 20psi, easing mechanical design
Typical Applications
- TIM1.5 and TIM2 for AI accelerator / GPU modules
- HPC server CPUs, switch chips, and advanced packaging
- Aluminum thermal modules and designs where gallium-based liquid metal is ruled out
- High-value modules that need rework or repeated assembly
Related Downloads
Need a SIBIN Sample or a Custom Melting Point?
Tell us your chip control temperature, power, and thermal module material — our technical team will help select a model or tune a dedicated melting point and conductivity.