From Servers to Steering Wheels
AI / HPC Servers
GPUs and switch chips generate extremely high heat flux, making the interface thermal resistance between heatsink and chip a performance bottleneck — while also requiring compatibility with automated dispensing production lines.
Automotive Electronics
IGBT, BMS, and ADAS modules face sustained vibration and severe thermal cycling; materials must deliver high resilience, high reliability, and delamination resistance while meeting automotive-grade reliability requirements.
Telecom / 5G
Base stations and RF modules face simultaneous thermal and EMI challenges across a frequency range spanning Sub-6GHz to mmWave, requiring solutions that integrate absorption and thermal management.
Consumer Electronics
Laptops, phones, and wearables prioritize slim form factors and low stress; materials must balance thermal management, protection of delicate components, and overall device weight within limited thickness.
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Narrow down your options with the selector tool, or tell us your operating conditions directly and we'll help you choose the right material.