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Choose the Right Material by the Numbers
Complete thermal interface solutions from low-melting alloy, thermal gel, and pads to phase change materials, paired with precision bonding and PUR technology. All specs are typical values — refer to the official TDS before mass production.
Advanced Thermal Interface Materials
Covering thermal flux needs from consumer electronics to AI servers; the SIBIN low-melting alloy and high-performance thermal gel are the top choice for AI/HPC.
| Model | Feature | Conductivity | Resistance (℃·cm²/W) |
|---|---|---|---|
| SIBIN#62 | 62℃ melting point · low-temperature gap filling | 12.0 W/m·K | 0.042 |
| SIBIN#92 | 75–94℃ melting point · mainstream CPU / GPU | 25.1 W/m·K | 0.036 |
| SIBIN#105 | 100–108℃ melting point · liquid-metal-class for AI / HPC | 33.2 W/m·K | 0.006 |
| Model Category | Feature | Conductivity | Category |
|---|---|---|---|
| Standard Pad | General-purpose cooling | 1–15 W/m·K | STANDARD |
| Ultra-Soft Pad | Extremely low compression stress | 3 / 6 / 8 W/m·K | SOFT |
| High-Resilience Pad | Resists vibration and thermal-cycling delamination | 6 / 13.5 / 20 W/m·K | RESILIENT |
| Low-Bleed Pad | Low oil bleed | 9 / 12 / 15 W/m·K | LOW-BLEED |
| Insulating Pad | Electrical insulation | 2 / 3 / 5 / 8 / 13 / 15 W/m·K | INSULATE |
| High-Durability Pad | Scratch and wear resistant | 12 / 15 / 18 W/m·K | DURABLE |
| Low-Volatility Pad | Ultra-low siloxane outgassing for optics and sealed enclosures | 3 / 5 / 8 W/m·K | LOW-VOLATILITY |
| Non-Silicone Pad | Silicone-free, eliminates silicone migration contamination | 2.5 / 3.5 W/m·K | NON-SILICONE |
| Model Category | Feature | Conductivity | Resistance |
|---|---|---|---|
| Aerospace-Grade Thermal Grease | High stability, low volatility | 1–3 W/m·K | — |
| High-Performance Thermal Grease | Mainstream CPU / GPU | 3 W/m·K | 0.13 |
| High-Conductivity Thermal Grease | High power density | 5 W/m·K | 0.07 |
| Model Category | Feature | Conductivity | Category |
|---|---|---|---|
| Standard Thermal Gel | Large-area contact | 3.5–14 W/m·K | STANDARD |
| Low-BLT Version | Ultra-thin bond line, lowers interface resistance | 3 / 6 W/m·K | LOW-BLT |
| Post-Cure Thermal Type | Flow-resistant after cure | 9 / 15 / 20 W/m·K | CURE |
| Reworkable Thermal Type | Removable for repair without damage | 3 W/m·K | REWORK |
| Lightweight Thermal Type | Reduces overall system weight | 2 / 3 W/m·K | LIGHT |
| Model Category | Thickness Range | Conductivity | Category |
|---|---|---|---|
| Ultra-Thin Carbon Fiber Pad | 0.1–0.3 mm | 25–50 W/m·K | ULTRA-THIN |
| Standard Carbon Fiber Pad | 0.3–2 mm | 20–70 W/m·K | HIGH-K |
| Ultra-Soft Carbon Fiber Pad | 1–3 mm | 25 W/m·K | SOFT |
| Model Category | Feature | Conductivity | Resistance |
|---|---|---|---|
| Insulating PCM | Combines insulation with low thermal resistance | 8.5 W/m·K | 0.04 |
| High-Performance PCM | Replaces degraded grease | 7.5 W/m·K | 0.05 |
| Low-Dielectric PCM | High-frequency signal friendly | 2–5 W/m·K | Low Dielectric |
Precision Bonding
A full electronic structural-adhesive lineup from underfill and low-temperature-cure epoxy to UV-cure adhesive, balancing structural strength, reworkability, and protection of heat-sensitive components.
- Reworkable Underfill / Reworkable Corner-Fill Adhesive
- Thermally Conductive Underfill 1–2 W/m·K
- High-Reliability Formulas for Automotive Modules
- Low-Temperature-Cure Epoxy (fingerprint / imaging / camera modules)
- UV-Cure Adhesive (high-gloss metal protection, instant waterproof cure)
- Water-Based Adhesive
- Two-Part Acrylic Adhesive
Spec sheet in progress: Full model lineup, viscosity, cure conditions, shear/tensile strength, and other data for precision bonding will be added as official spec sheets and TDS once available.
PUR Polyurethane Solutions
High initial-strength, impact-resistant bonding solutions for different substrates and processes. Known characteristics are listed below; viscosity and initial-strength values are pending.
| Feature / Application | Description | Open Time |
|---|---|---|
| PC Substrate | Designed for PC substrates | 4–6 min |
| PA / ABS Specialist | Specialized for PA / ABS substrates | 4 min |
| Ultimate Impact Resistance | Handles the highest-strength drop and mechanical impact | 4 min |
| High Clarity / Heat & Humidity Resistant | High transparency, resistant to heat and humidity | 10 min |
| Easy-Rework Type | Excellent ease of rework | 4–5 min |
| String-Free Type | No stringing issues | < 6 min |
| Ultra-High Initial Strength | Outstanding ultra-high initial strength | 2–3 min |
| Jetting Process Specific | Designed specifically for jetting processes | 4–6 min |
| LCM Edge / Camera Bonding | Low-viscosity light-blocking black adhesive for camera apertures | < 3 min |
| Wearable Matte Finish | Matte finish, oleic-acid and sebum resistant — first choice for smart watches / bands | — |
| Sealing Specific | Ultra-low viscosity for demanding micro-gap sealing | — |
Values pending: Viscosity (cPs), initial strength, and official model names for each type are pending and will be added to the complete spec sheet.
Absorption / Shielding Materials
From mechanical absorbers to EMI shielding, covering Sub-6GHz to 77/100GHz.
| Model Category | Frequency Band / Feature | Conductivity | Category |
|---|---|---|---|
| Injection-Molded Absorber | Low frequency / Sub-6GHz / 77 · 100GHz | — | ABSORBER |
| Thermally Conductive Absorber Pad | Absorption plus heat dissipation | 3 / 5 W/m·K | TIM+EMI |
| Thermally Conductive Absorber Gel | Complex-structure gap fill | 6–8 W/m·K | TIM+EMI |
| Conductive Rubber / Sealing Gasket | EMI shielding + environmental sealing | — | SHIELD |
Heat Pipes
Our cooling-component line. Four wick structures cover different power and space envelopes: Φ6–Φ12 diameters, ultra-thin flattening from 0.4mm, custom bending and sampling.
- Sintered powder — low cost, stable process, general electronics
- Grooved — strong capillary force and anti-gravity performance, first choice for servers
- Mesh & fiber — workable down to 0.3mm, phones and thin-and-light notebooks
- Composite — high power with excellent anti-gravity performance
Not sure which one to use?
Tell us your power, gap, and operating temperature — our technical team will help you select and provide samples.