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Choose the Right Material by the Numbers
Complete thermal interface solutions from liquid metal, thermal gel, and pads to phase change materials, paired with precision bonding and PUR technology. All specs are drawn from product datasheets — refer to the official TDS before mass production.
Advanced Thermal Interface Materials
Covering thermal flux needs from consumer electronics to AI servers; liquid metal and high-performance thermal gel are the top choice for AI/HPC.
| Model Category | Feature | Conductivity | Category |
|---|---|---|---|
| Standard Pad | General-purpose cooling | 1–15 W/m·K | STANDARD |
| Ultra-Soft Pad | Extremely low compression stress | 3 / 6 / 8 W/m·K | SOFT |
| High-Resilience Pad | Resists vibration and thermal-cycling delamination | 6 / 13.5 / 20 W/m·K | RESILIENT |
| Low-Bleed Pad | Low oil bleed | 9 / 12 / 15 W/m·K | LOW-BLEED |
| Insulating Pad | Electrical insulation | 2 / 3 / 5 / 8 / 13 / 15 W/m·K | INSULATE |
| High-Durability Pad | Scratch and wear resistant | 12 / 15 / 18 W/m·K | DURABLE |
| Low-Volatility Pad | Ultra-low siloxane outgassing for optics and sealed enclosures | 3 / 5 / 8 W/m·K | LOW-VOLATILITY |
| Non-Silicone Pad | Silicone-free, eliminates silicone migration contamination | 2.5 / 3.5 W/m·K | NON-SILICONE |
| Model Category | Feature | Conductivity | Resistance |
|---|---|---|---|
| Aerospace-Grade Thermal Grease | High stability, low volatility | 1–3 W/m·K | — |
| High-Performance Thermal Grease | Mainstream CPU / GPU | 3 W/m·K | 0.13 |
| High-Conductivity Thermal Grease | High power density | 5 W/m·K | 0.07 |
| Liquid Metal Grease GMAP | Ultimate thermal performance for AI / HPC | 10 W/m·K | 0.03 |
| Model Category | Feature | Conductivity | Category |
|---|---|---|---|
| Standard Thermal Gel | Large-area contact | 3.5–14 W/m·K | STANDARD |
| Low-BLT Version | Ultra-thin bond line, lowers interface resistance | 3 / 6 W/m·K | LOW-BLT |
| Post-Cure Thermal Type | Flow-resistant after cure | 9 / 15 / 20 W/m·K | CURE |
| Reworkable Thermal Type | Removable for repair without damage | 3 W/m·K | REWORK |
| Lightweight Thermal Type | Reduces overall system weight | 2 / 3 W/m·K | LIGHT |
| Model Category | Thickness Range | Conductivity | Category |
|---|---|---|---|
| Ultra-Thin Carbon Fiber Pad | 0.1–0.3 mm | 25–50 W/m·K | ULTRA-THIN |
| Standard Carbon Fiber Pad | 0.3–2 mm | 20–70 W/m·K | HIGH-K |
| Ultra-Soft Carbon Fiber Pad | 1–3 mm | 25 W/m·K | SOFT |
| Model Category | Feature | Conductivity | Resistance |
|---|---|---|---|
| Insulating PCM | Combines insulation with low thermal resistance | 8.5 W/m·K | 0.04 |
| High-Performance PCM | Replaces degraded grease | 7.5 W/m·K | 0.05 |
| Low-Dielectric PCM | High-frequency signal friendly | 2–5 W/m·K | Low Dielectric |
Precision Bonding
Reworkable underfill and thermally conductive underfill, balancing structural strength, reworkability, and thermal conductivity.
- Reworkable Underfill / Reworkable Corner-Fill Adhesive
- Thermally Conductive Underfill 1–2 W/m·K
- High-Reliability Formulas for Automotive Modules
Spec sheet in progress: Full model lineup, viscosity, cure conditions, shear/tensile strength, and other data for precision bonding will be added as official spec sheets and TDS once available.
PUR Polyurethane Solutions
High initial-strength, impact-resistant bonding solutions for different substrates and processes. Known characteristics are listed below; viscosity and initial-strength values are pending.
| Feature / Application | Description | Open Time |
|---|---|---|
| PC Substrate | Designed for PC substrates | 4–6 min |
| PA / ABS Specialist | Specialized for PA / ABS substrates | 4 min |
| Ultimate Impact Resistance | Handles the highest-strength drop and mechanical impact | 4 min |
| High Clarity / Heat & Humidity Resistant | High transparency, resistant to heat and humidity | 10 min |
| Easy-Rework Type | Excellent ease of rework | 4–5 min |
| String-Free Type | No stringing issues | < 6 min |
| Ultra-High Initial Strength | Outstanding ultra-high initial strength | 2–3 min |
| Jetting Process Specific | Designed specifically for jetting processes | 4–6 min |
Values pending: Viscosity (cPs), initial strength, and official model names for each type are pending and will be added to the complete spec sheet.
Absorption / Shielding Materials
From mechanical absorbers to EMI shielding, covering Sub-6GHz to 77/100GHz.
| Model Category | Frequency Band / Feature | Conductivity | Category |
|---|---|---|---|
| Injection-Molded Absorber | Low frequency / Sub-6GHz / 77 · 100GHz | — | ABSORBER |
| Thermally Conductive Absorber Pad | Absorption plus heat dissipation | 3 / 5 W/m·K | TIM+EMI |
| Thermally Conductive Absorber Gel | Complex-structure gap fill | 6–8 W/m·K | TIM+EMI |
| Conductive Rubber / Sealing Gasket | EMI shielding + environmental sealing | — | SHIELD |
Not sure which one to use?
Tell us your power, gap, and operating temperature — our technical team will help you select and provide samples.