Products / Advanced Thermal Interface / Liquid Metal Alloy GMAP
Advanced Thermal Interface · Liquid Metal
Liquid Metal Alloy GMAP
AI / HPCUltimate Thermal PerformanceAutomated Dispensing
A liquid metal thermal interface material engineered for the high heat-flux demands of AI / HPC, delivering industry-leading thermal conductivity and the lowest interface thermal resistance, compatible with automated dispensing lines.
10W/m·K
Thermal Conductivity
0.03Resistance
Interface Resistance (Lowest)
Technical Specifications
Specifications
Thermal Conductivity10 W/m·K
Thermal Resistance0.03 ℃·in²/W
Material TypeLiquid Metal Alloy
Recommended ApplicationAI / HPC, high-power chips
Dispensing MethodAutomated Dispensing
Operating TemperatureTBD
DensityTBD
Recommended BLTTBD
Packaging / SpecificationTBD
Official Part NumberTBD
Specifications in progress: Fields marked "TBD" will be filled in once the manufacturer provides official data; current values are drawn from the product deck — refer to the official TDS before mass production.
Why Choose GMAP
Product Advantages
- Industry-leading thermal conductivity for the high heat flux of AI / HPC chips
- Lowest interface thermal resistance at 0.03, effectively lowering junction temperature
- Compatible with automated dispensing lines for consistent mass production
Applications
Typical Applications
- AI accelerator / GPU module cooling
- HPC server CPUs and switch chips
- High power density applications extremely sensitive to thermal resistance
Technical Documents
Related Downloads
SDS
GMAP Safety Data Sheet (SDS)
GHS 16-section format
PDF
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